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| Parameter | Description | Value |
|---|---|---|
| Gold Purity | Purity level of gold used in bonding | 99.99% |
| Wire Diameter | Diameter of the gold wire | 25 µm |
| Bonding Technique | Technique used for wire bonding | Ultrasonic Bonding |
| Operating Temperature | Temperature range for the bonding process | -40°C to +125°C |
| Application Areas | Industries utilizing gold wire bonding | Semiconductors, Medical Devices, Aerospace |
| Quality Certifications | Quality assurance certifications held | ISO 9001, TS16949 |