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| Technique | Description | Advantages | Applications |
|---|---|---|---|
| Surface Mount Technology (SMT) | A method where electronic components are mounted directly onto the surface of printed circuit boards. | High density, reduced size, automated assembly capabilities. | Consumer electronics, telecommunications, data processing. |
| Through-Hole Technology | Components are inserted into holes drilled in the circuit board and soldered on the opposite side. | Stronger mechanical connections, easier repairability. | Power supplies, large components, older designs. |
| Mixed Technology | Combines SMT and through-hole technology on a single board. | Utilizes the strengths of both techniques for optimal results. | Complex devices requiring both strong and small components. |
| Reflow Soldering | A soldering process that melts solder paste to bond components to the PCB. | Fast, efficient, suitable for high volume production. | Used universally in SMT applications. |
| Wave Soldering | Involves passing the PCB over a wave of molten solder to connect through-hole components. | Cost-effective for high-volume production. | Ideal for through-hole components and PCBs without SMT. |