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| Process Parameter | Benchmark Value | Achieved Value | Comments |
|---|---|---|---|
| Pull Force (gram) | 80 | 85 | Exceeds target |
| Bonding Time (seconds) | 1.5 | 1.3 | Improved efficiency |
| Defect Rate (%) | 2.0 | 1.0 | Significant reduction |
| Temperature Control (°C) | 150 | 145 | Optimal conditions maintained |
| Wire Diameter (μm) | 25 | 25 | Consistent quality |