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| Process Step | Description | Key Parameters | Performance Metrics |
|---|---|---|---|
| Wire Preparation | Ensure wire is cut to appropriate lengths and cleaned | Wire Diameter: 25µm | Yield: 98% |
| Bonding | Attach wire to die and pad using a combination of heat and ultrasonic energy | Temperature: 150°C | Bond Strength: 50g |
| Bond Inspection | Visual and automated inspection to ensure quality | Inspection Frequency: 100% | Defect Rate: <1% |
| Final Testing | Electrical tests to validate performance | Test Current: 10mA | Pass Rate: 99% |
| Packaging | Secure packaging to prevent damage during shipment | Material: Antistatic Bags | Packaging Compliance: ISO 9001 |