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| Dimension | Value |
|---|---|
| Manufacturing Process | Thermal Compression |
| Material Used | 99.99% Pure Gold |
| Bonding Type | Ball Bonding |
| Wire Diameter | 25.4 μm |
| Production Capacity | 500,000 Units/Month |
| Quality Certification | ISO 9001 |
| Primary Application | Semiconductor Devices |
| Key Markets | Electronics, Automotive, Aerospace |