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| Material Type | Bonding Wire Diameter | Typical Applications | Production Capacity | Quality Certification |
|---|---|---|---|---|
| Gold (Au) | 25 µm | Integrated Circuits | 500 kg/month | ISO 9001 |
| Gold (Au) | 30 µm | Moore Devices | 300 kg/month | ISO 13485 |
| Copper (Cu) | 18 µm | Automotive Electronics | 700 kg/month | ISO 9001 |
| Aluminum (Al) | 25 µm | Consumer Electronics | 400 kg/month | ISO 9001 |
| Gold (Au) | 15 µm | RFID Tags | 250 kg/month | ISO 14001 |