Mathata a mangata a fapaneng a ka hlaha ho Kopano ea PCB. Tsena li kenyelletsa likarolo tse sieo, lithapo tse sothehileng kapa tse sothehileng, ho sebelisa likarolo tse fosahetseng, ho soasoa ka mokhoa o sa lekaneng, manonyeletso a teteaneng haholo, lithapo tse kobehileng tsa IC, le ho hloka metsi. Ho felisa mefokolo ena, tlhahlobo e hlokolosi ea likarolo tse kopaneng le tse rekisoang ke tsa bohlokoa. Leha ho le joalo, likarolo li fetohile tse nyane haholo ho theosa le lilemo, 'me 3D AOI e sebelisoa ho fumana liphoso tse rarahaneng.
Le hoja 2D AOI e itšetlehile ka litšoantšo tse hlophisitsoeng ho hlahloba likarolo, ho sebelisa phapang ea mebala le ho hlahloba bohlooho, 3D AOI e sebelisa li-module tsa litšoantšo tsa 3D tse tsoetseng pele (mohlala, projector e le 'ngoe ea DLP + lik'hamera tse nang le mahlakore a mangata) ho nka limmapa tsa bophahamo le data ea volumetric. Molemo o totobetseng ke hore 3D AOI e khona ho tseba liphoso tse sa bonahaleng ka mahlo (libaka tse nang le moriti, mohlala, tlas'a likarolo tse telele tse kang li-connectors kapa capacitor), ho fokotsa palo ea liphoso tse thellang nakong ea tlhahlobo 'me e ka ba tse nepahetseng haholoanyane.
Li nepahetse haholo hobane li nka litšoantšo tse ngata ho tloha mahlakoreng a fapaneng. Mochini oa 3D AOI o sebelisa software ho bapisa PCB eo e e hlahlobang le setšoantšo seo e hlophisitsoeng ka sona. E ntan'o tlaleha liphapang leha e le life, ho kenyeletsa sebaka, tekanyo ea litekanyo, le ho se lumellane ha likarolo.
3D AOI e bohlokoa bakeng sa mafapha a tsoetseng pele:
Likoloi: E netefatsa ts'epahalo bakeng sa li-PCB tsa bohlokoa tsa polokeho (mohlala, li-module tsa ADAS)
Lisebelisoa tsa bongaka: E netefatsa botšepehi ba solder ho lisebelisoa tsa elektronike tse kentsoeng.
Aerospace: E kopana le litekanyetso tsa IPC tsa Sehlopha sa 3 bakeng sa likopano tse tšepahalang haholo.
Tse ling tsa li-PCBA tsa bona li rarahane 'me li na le boima bo phahameng, tse ka bakang likotsi tse patehileng tsa bokooa, tse kang li-smartphone, matlapa, li-smartwatches, likhalase tsa AR, lisebelisoa tsa ho laola motlakase, le lisebelisoa tse tsoetseng pele tsa lithuso tsa mokhanni likoloing, li-pacemaker tsa pelo, li-neurostimulators, li-portable monitors, li-industrial automation control modules, 5G base stations, optical PCBA, joalo-joalo. metsoako e matla haholo e tla sebelisa 3D AOI ho bona bofokoli ba bolo ea solder ea BGA/LGA, joalo ka likaroloana tse nyane joalo ka likarolo tsa sephutheloana sa 01005 (0.4mm×0.2mm).
Re na le bokhoni ba ho hlahisa lihlahisoa tsena tse nepahetseng haholo bakeng sa bareki. 'Me joalo ka letsete la leano la ho fihlela bokhabane ba tlhahiso, re sebelisa metjhini ea 3D AOI ho ntlafatsa boleng le katleho ea likopano tsa rona tsa PCB.
Boleng ba 3D AOI bo fetela ka nģ'ane ho ho lemoha sekoli ho sebetsa ka katleho, taolo ea litšenyehelo, le ho etsa liqeto ho itšetlehileng ka data.
Ntlafatso ea Ts'ebetso
1. E lekanya molumo oa solder paste, bophahamo, le ho theoha, ho fana ka maikutlo a nako ea sebele ho li-printer tsa stencil (mohlala, ho lokisa khatello ea stencil kapa lebelo la squeegee) ho thibela bofokoli ba batch-level soldering.
2. Hlahloba mefuta e sa tšoaneng ea PCBs. Ke sesebelisoa se feto-fetohang bakeng sa tlhahlobo ea boleng.
3. E ts'ehetsa ho lemoha lihlahisoa tse ngata (mohlala, ho fetoha ho tloha ho li-motherboards tsa TV ho ea ho li-PCB tsa adapter ea matla) ka
4. E lemoha liboto tse tsoakiloeng tsa THT (ka lesoba) le liboto tsa SMT.
5. E sheba mahlakore ka bobeli a boto ka nako e le 'ngoe, ka potlako le ka katleho.
Taolo ea Litšenyehelo
1. E lemoha litaba tsa soldering sethaleng sa SMT (khahlanong le post-assembly) e theola litšenyehelo tsa ho tsosolosa ka boto ka 70% (ha ho na ho qhaqhoa ha li-enclosures / cables tse hlokahalang).
2. E ntlafatsa boemo ba mocheso ka har'a liontong tsa reflow, e fokotsa litšila tsa matla ka 15-25%.
3. Phokotso ea litefiso tsa ho khutlisa lisebelisoa tsa elektronike tsa bareki e boloka litšenyehelo tsa ka mor'a thekiso le ho qoba likotsi tsa ho latela melao.
Ho etsa liqeto ka data
E ka khona ho khetholla mefuta ea sekoli ea sebaka sa marang-rang (mohlala, solder e batang, ho se khethollehe hantle) ho supa mathata a ts'ebetso (mohlala, ho roaloa ha li-nozzle mochining oa ho khetha le ho beha sebaka, liphoso tsa ontong ea reflow).
Nako ea poso: Mar-31-2025