Hiki ke loaʻa nā pilikia like ʻole ma PCB Assembly. ʻO kēia nā mea i nalowale, nā uea i hoʻoneʻe ʻia a wili paha, me ka hoʻohana ʻana i nā ʻāpana hewa ʻole, lawa ʻole ke kūʻai ʻana, nā hono mānoanoa loa, nā pine IC piʻo, a me ka ʻole o ka pulu. No ka hoʻopau ʻana i kēia mau hemahema, pono ka nānā pono ʻana i nā ʻāpana i hui ʻia a kūʻai ʻia. Eia naʻe, ua liʻiliʻi loa nā ʻāpana i nā makahiki, a ua hoʻohana ʻia ʻo 3D AOI e ʻimi i nā hemahema paʻakikī.
ʻOiai ke hilinaʻi nei ʻo 2D AOI i ke kiʻi planar e nānā i nā ʻāpana, me ka hoʻohana ʻana i ka ʻokoʻa kala a me ka nānā ʻana i ka hina hina, hoʻohana ʻo 3D AOI i nā modula kiʻi 3D kiʻekiʻe (e laʻa, hoʻokahi DLP projector + multi-angle cameras) e hopu i nā palapala kiʻekiʻe a me ka ʻikepili volumetric. ʻO ka pōmaikaʻi ʻike ʻia ʻo ia ka hiki i ka 3D AOI ke ʻike i nā hemahema i ʻike ʻole ʻia e ka maka ʻōlohelohe (nā wahi i uhi ʻia, e laʻa, ma lalo o nā ʻāpana kiʻekiʻe e like me nā mea hoʻohui a i ʻole capacitors), e hōʻemi ana i ka nui o nā hemahema e paheʻe ma ke kaʻina nānā a hiki ke ʻoi aku ka pololei.
ʻOi aku ka pololei no ka mea lawe lākou i nā kiʻi he nui mai nā kihi like ʻole. Hoʻohana ka mīkini AOI 3D i nā lako polokalamu e hoʻohālikelike i ka PCB āna e nānā ai i ke kiʻi i hoʻolālā ʻia me ia. A laila e hōʻike i nā ʻokoʻa like ʻole, me ka wahi, ke ana ʻana o nā ana, a me ka misalignment o nā ʻāpana.
He mea koʻikoʻi ʻo 3D AOI no nā ʻāpana holomua:
Automotive: E hōʻoia i ka hilinaʻi no nā PCB koʻikoʻi palekana (e laʻa, ADAS modules)
Nā mea lapaʻau: Hōʻoia i ka pono o ka solder i loko o nā mea uila implantable.
Aerospace: Hoʻokō i nā kūlana IPC Class 3 no nā hui hilinaʻi kiʻekiʻe.
ʻO kekahi o kā lākou PCBA he paʻakikī a he kiʻekiʻe kiʻekiʻe, hiki ke hōʻeha i nā pōʻino huna, e like me nā smartphones, tablets, smartwatches, AR glasses, electronic control units, a me nā ʻōnaehana kōkua hoʻokele kiʻekiʻe i nā kaʻa, pacemakers cardiac, neurostimulators, portable monitors, industry automation control modules, 5G base stations, optical communication equipment, etc. 3D AOI no ka ʻike ʻana i nā pōʻino pōleʻa solder BGA/LGA, e like me nā ʻāpana micro-scale e like me 01005 ʻāpana pūʻolo (0.4mm×0.2mm).
Loaʻa iā mākou ka hiki ke hana i kēia mau huahana kiʻekiʻe no nā mea kūʻai aku. A ma ke ʻano he waiwai hoʻolālā i ka hoʻokō ʻana i ka maikaʻi o ka hana ʻana, hoʻohana mākou i nā mīkini 3D AOI e hoʻomaikaʻi i ka maikaʻi a me ka pono o kā mākou hui PCB.
ʻOi aku ka waiwai o 3D AOI ma mua o ka ʻike ʻana i nā hemahema no ka hoʻokō ʻana i ka loiloi, ka hoʻokele kumukūʻai, a me ka hoʻoholo ʻana i ka ʻikepili.
Kaʻina Hana
1. E ana i ka nui o ka paʻi solder, ke kiʻekiʻe, a me ka hāʻule ʻana, me ka hāʻawi ʻana i nā manaʻo manawa maoli i nā mea paʻi stencil (e laʻa, hoʻololi i ke kaomi stencil a i ʻole ka wikiwiki squeegee) e pale ai i nā pōʻino kūʻai pae.
2. Nānā i nā ʻano PCB like ʻole. He mea hana maʻalahi no ka hoʻāʻo ʻana i ka maikaʻi.
3. Kākoʻo i ka ʻike ʻana i nā huahana he nui (e laʻa, ke hoʻololi ʻana mai nā motherboards TV a i nā PCB adapter mana) me <5 mau minuke hoʻololi manawa, e hoʻohālikelike ana me nā ʻano kiʻekiʻe-mix, haʻahaʻa-volume.
4. ʻIke i nā papa THT hui ʻia (ma loko o ka puka) a me nā papa SMT.
5. Nānā i nā ʻaoʻao ʻelua o ka papa i ka manawa hoʻokahi, ʻoi aku ka wikiwiki a ʻoi aku ka maikaʻi.
Hoʻoholo Kūʻai
1. ʻIke i nā pilikia kūʻai ma ke kahua SMT (vs. post-assembly) e hoʻemi i nā kumukūʻai hana hou i kēlā me kēia papa e 70% (ʻaʻole pono e wehe ʻia nā paʻi / uwea).
2. Hoʻonui i ka hoʻopili ʻana i ka wela ma nā umu reflow, e ʻoki ana i ka ʻōpala ikehu ma 15-25%.
3. Hoʻemi ʻia nā uku hoʻihoʻi no nā mea uila uila e mālama i nā kumukūʻai ma hope o ke kūʻai ʻana a pale i nā pilikia hoʻokō.
Hoʻoholo hoʻoholo i ka ʻikepili
Hiki iā ia ke ʻike maʻalahi i nā puʻunaue spatiotemporal o nā ʻano hemahema (e laʻa, ka mea kūʻai anu, misalignment) e ʻike i nā pilikia kaʻina hana (e laʻa, ke komo ʻana o ka nozzle i nā mīkini koho-a-wahi, reflow umu anomalies).
Ka manawa hoʻouna: Mar-31-2025